We are looking for second hand wedge bonder machine automatic ultrasonic. Please offer your models equivalent to model no. AB-530. The specification of the required automatic ultrasonic wedge bonder machine is as below.
Z Travel 25mm (1)
Bond Angle: 30
Wire diameter: 20-50pm (0.8-2 mil)
Bond force: Programmable (5 200g)
Bond Power: Programmable (0 1W)
Wire clamp force: Programmable (30 200g)
Cycle time: 125 ms for 2mm (79mil) wire length
Feed and tear
Tail length: Programmable
XY Travel: 66mm X 66mm (2.6 2.6 )
Material Handling System
PCB Size: Max. Radius 254mm (10 radius)
Depends on position of die
Fine Pitch Compatibility: 1mil wire diameter
Pad Size 63 X 80 pm
Pad Pitch: 68 pm
Please offer us the machine giving make, detailed spec, condition, age and price. Awaiting your return reply.
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